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Dr. Philip J. Reucroft;
Professor, received his Ph.D. from Imperial College, London, England. His
current research interests include surface and interface analysis, thin film
fabrication and analysis, coal and catalyst characterization, porous carbon
materials and electronic properties of semiconducting and metallic systems. General
research objectives are to obtain a better understanding of the structural
and compositional characteristics of surfaces/interfaces and how materials
properties are influenced by these characteristics. a)
Surface analysis and structural characterization of single layer and
multilayer materials that have been fabricated by CVD and PVD techniques (b)
Wear resistant coatings on machine tools (c)
Thermodynamics of gas and vapor interactions with microporous/mesoporous
carbons and polymers (d)
Surface analysis of novel materials, heterogeneous catalysts and carbonaceous
materials (e)
Electrical characteristics of semiconducting and metallic systems. Recent Publications (12 of 235) 1.
H. S. Moon,
S. W. Lee, W. H. Lee, P. J. Reucroft and J. W. Park, “Electrochemical
Characterization of LiMxMn2-xO4(M=Co,Al,Cu)
Thin Films”, presented at the 202nd Meeting of the Electrochemical
Society, Salt Lake City, Utah, October 20-25, 2002. 2.
P. J.
Reucroft, D. Rivin and N. S. Schneider, “Thermodynamics of Nafion-Vapor
Interactions. I. Water Vapor”, Polymer, Vol. 43, p. 5157 (2002). 3.
Y. K. Ko, B.
S. Seo, D. S. Park, H. J. Yang, W. H. Lee, P. J. Reucroft and J. G.
Lee,”Additive Vapor Effect on the Conformal Coverage of a High Aspect Ratio
Trench using MOCVD Copper Metallization from (hfac)Cu(DMB) Precursor”,
Semiconductor Science and Technology, Vol. 17, p. 978 (2002). 4.
P. J.
Reucroft and S. K. Pradhan,”Metalorganic Chemical Vapor Deposition of
Titanium Oxy-nitride Thin Films using Titanium Isopropoxide and Ammonia”,
presented at the 2002 TMS Fall Meeting Symposium “Chemistry and Physics of
Materials”, Columbus, OH, October, 2002. 5.
S. K.
Pradhan and P. J. Reucroft,”A Study of Growth and Morphological Features of
TiOxNy Thin Films Prepared by MOCVD”, J. Crystal
Growth, Vol. 250, p. 588 (2003). 6.
S. K.
Pradhan and P. J. Reucroft,” Influence of Flow Rate and Deposition
Temperature on TiOxNy Film Growth and Morphology”,
presented at the 2003 TMS Annual Meeting, San Diego, California,March, 2003;
“Surface Engineering in Materials Science II”, edited by S. Seal, N. B.
Dahrotre, J. Moore, S.Suryanarayana and A. Agarwal, TMS (The Minerals, Metals
and Materials Society), p. 57 (2003). 7.
S. K.
Pradhan, P. J. Reucroft and Y. Ko,”Crystallinity of Al2O3 Films
Deposited by Metalorganic Chemical Vapor Deposition”, Surface and Coatings
Technology, in press. 8.
Y. K. Ko, J.
H. Jang, S.Lee, H. J. Yang, W. H. Lee, P. J. Reucroft and J. G. Lee,”Effects
of Molybdenum, Silver Dopants and a Titanium Substrate Layer on Copper Film
Metallization”, J. Mats. Sci., Vol. 38, p. 217 (2003). 9.
Y. K. Ko, J.
H. Jang, H. J. Yang, W. H. Lee, P. J. Reucroft and J. G. Lee,”Thickness
Effect on Grain Growth and Precipitate Coarsening of a Cu(Ag) Thin Film in an
Advanced Metallization Process”, J. Mats. Sci.: Materials in Electronics,
Vol. 14, p. 103 (2003). 10.
Y. K. Ko, D. S. Park, B. S. Seo, H. J.
Yang, H. J. Shin, J. Y. Kim, J. H. Lee, W. H. Lee, P. J. Reucroft and J. G.
Lee,”Comparison Studies of Cobalt Thin Films Deposited by Sputtering and
MOCVD”, Materials Chemistry and Physics, Vol. 80, p. 560 (2003). 11. P. J. Reucroft, D. Rivin and N. S.
Schneider,”Characterization of Thin Films by Flow Microcalorimetry”, Proceedings
of the Thermec’2003 International Conference, “Processing and Manufacturing
of Advanced Materials”, Leganes, Madrid, Spain, July 7-11, 2003. 12. S. K. Pradhan, P. J. Reucroft, F.
Yang and A. Dozier,”Growth of TiO2 Nanorods by Metalorganic
Chemical Vapor Deposition”, J. Crystal Growth, Vol. 256, p. 83-88 (2003). 1.
"Effect of Si Powder Refining on the Self-Propagating High Temperature
Synthesis Reaction of Titanium Silicide Induced by Mechanical Alloying",
J. Mats. Sci. Letters, in press. 2.
"X-ray Photoelectron Spectroscopic Studies of Surface Modified
Single-walled Carbon Nanotube Materials", Appl. Surf. Sci., in press. 3.
"Microstructure Control of Copper Films by Addition of Mo in an Advanced
Metallization Process", J. Electronic Materials, in press. 4.
"Growth Mechanisms of Amorphous and Semi-crystalline Alumina Thin Films
Deposited by MOCVD", submitted to Thin Solid Films. 5.
"Thermodynamics of Nafion - Vapor Interactions. I. Water Vapor",
submitted to Polymer. 6.
"Additive Gas Effects on MOCVD Copper Films Deposited from
(hfac)Cu(DMB)(3,3-dimethyl-1-butene)" submitted to J. Electronic
Materials. 7.
"Conformal Coverage of MOCVD Copper Film on a High Aspect Ratio
Trench", submitted to Thin solid Films. Recent PhD Students (since 1990) Student:
Y. K. Ko Student:
W. H. Lee Student:
J. Y. Kim Student:
J. S. Kim Student:
H. W. Woo Student:
A. R. Sethuraman Student:
S. K. Pradhan Current Funding and Industrial Collaborators Natick
Soldier Center, Natick, Massachusetts |
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