Laser Processing Laboratory

659 FPAT

(859) 257-1462

The Laser Processing Laboratory uses excimer laser micromachining to pattern films, cut grooves, drill holes, and modify surfaces.  All types of materials are processed including thin metal films on polymer sheets, polymer substrates, ceramic substrates, glass slides, and carbon nanotubes.  Many collaborative projects utilize the Laser Processing Laboratory to fabricate nanovials in thick film multilayer structures, nanovials in glass and polymers, conductive vias in ceramic substrates, microfluidic channels, and pattern gossamer films.  Dr. Janet Lumpp has over 15 years of experience with materials processing, excimer lasers, and electronic packaging. 

Equipment

Excimer Laser Micromachining System

The centerpiece of the Laser Processing Lab is the excimer laser micromachining system powered by a Lambda Physik Compex laser.  The beam delivery optics and sample processing chamber are designed for flexible machining of all types of materials.  We typically run KrF gas in the laser generating nanosecond pulses at 248 nm.  The beam energy is controlled by the laser voltage setting, a zero offset variable attenuator, and the MicroLas beam homogenizer.  The beam homogenizer produces a uniform intensity field 10-14 mm square to illuminate a mask or aperture.  Under the final imaging lens, the sample and chamber move on stepper motor controlled XY stages with 2 mm accuracy.  Within the chamber, the atmosphere can be a process gas or pumped out through mechanical and turbo vacuum pumps.  Laser machined features can immediately be viewed and measured using the optical microscope and Tencor stylus profilometer.

Zeiss Axiotech Optical Microscope - CCD camera, Sony video printer

Tencor Alpha Step 500 Stylus Profilometer - 2 mm vertical range