Dr. John Balk Materials Engineering

Publications

**PUBLICATIONS IN REFEREED, ARCHIVAL JOURNALS (* = Corresponding author)**

29. Li, W.-C. and T.J. Balk*, “Preparation and Hydrogen Absorption/Desorption of Nanoporous Palladium Thin Films”, submitted to Materials (October 2009).

28. Li, W.-C. and T.J. Balk*, “Transition from Single- to Multi-layered Structures in Nanoporous Gold-Palladium Ultrathin Films”, submitted to Thin Solid Films (September 2009).

27. Li, W.-C. and T.J. Balk*, “Achieving Finer Pores and Ligaments in Nanoporous Palladium-Nickel Thin Films”, Scripta Materialia (in press, to appear in 2010).

26. T.J. Balk*, C. Eberl, Y. Sun, K.J. Hemker and D.S. Gianola, “Tensile and Compressive Microspecimen Testing of Bulk Nanoporous Gold”, JOM (in press, to appear in December 2009).

25. Li, W.-C. and T.J. Balk*, “Effects of Substrate Curvature on Dealloying of Nanoporous Thin Films”, Scripta Materialia, 61, pp. 1125-1128 (2009).

24. Li, W.-C., S. Roberts and T.J. Balk*, “Effects of Substrate Bias on Microstructure of Osmium-Ruthenium Coatings for Porous Tungsten Dispenser Cathodes”, IEEE Transactions on Electron Devices, 56, pp. 805-811 (2009).

23. Y. Sun, J. Ye, A.M. Minor and T.J. Balk*, “In Situ Indentation of Nanoporous Gold Thin Films in the Transmission Electron Microscope”, Microscopy Research and Technique, 72, pp. 232-241 (2009).

22. Y. Sun and T.J. Balk*, “Evolution of Structure, Composition, and Stress in Nanoporous Gold Thin Films with Grain-Boundary Cracks”, Metallurgical and Materials Transactions A, 39, pp. 2656-2665 (2008).

21. J. Lohmiller, C. Eberl, R. Schwaiger, O. Kraft and T.J. Balk*, “Mechanical Spectroscopy of Nanocrystalline Nickel Near Room Temperature”, Scripta Materialia, 59, pp. 467-470 (2008).

20. Y. Sun, K.P. Kucera, S.A. Burger and T.J. Balk*, “Microstructure, Stability and Thermomechanical Behavior of Crack-Free Thin Films of Nanoporous Gold”, Scripta Materialia, 58, pp. 1018-1021 (2008).

19. M. Legros*, G. Dehm, E. Arzt and T.J. Balk, “Observation of Giant Diffusivity Along Dislocation Cores”, Science, 319, pp. 1646-1649 (2008).

18. Y. Sun and T.J. Balk*, “A Multi-Step Dealloying Method to Produce Nanoporous Gold with No Volume Change and Minimal Cracking”, Scripta Materialia, 58, pp. 727-730 (2008).

17. Y. Sun, J. Ye, Z. Shan, A.M. Minor and T.J. Balk*, “The Mechanical Behavior of Nanoporous Gold Thin Films”, JOM, 59, pp. 54-58 (2007).

16. X. Lu, E. Bischoff, R. Spolenak and T.J. Balk*, “Investigation of Dealloying in Au-Ag Thin Films by Quantitative Electron Probe Microanalysis”, Scripta Materialia, 56, pp. 557-560 (2007).

15. T.J. Balk*, K.J. Hemker and L.P. Kubin, “On Anomalous Strain Hardening in Iridium Crystals”, Scripta Materialia, 56, pp. 389-392 (2007).

14. X. Lu, T.J. Balk*, R. Spolenak and E. Arzt, “Dealloying of Au-Ag Thin Films with a Composition Gradient: Influence on Morphology of Nanoporous Au”, Thin Solid Films, 515, pp. 7122-7126 (2007).

13. M. Legros*, B. Kaouache, P. Gergaud, O. Thomas, G. Dehm, T.J. Balk and E. Arzt, “Pipe-Diffusion Ripening of Si Precipitates in Al-0.5%Cu-1%Si Thin Films”, Philosophical Magazine, 85, pp. 3541-3552 (2005).

12. C. Daniel*, T.J. Balk, T. Wübben and F. Mücklich, “Bio-Mimetic Scaling of Mechanical Behavior of Thin Films, Coatings, and Surfaces by Laser Interference Metallurgy”, Advanced Engineering Materials, 7, pp. 823-826 (2005).

11. F. Girgsdies, T. Ressler*, U. Wild, T. Wübben, T.J. Balk, G. Dehm, L. Zhou, S. Günther, E. Arzt, R. Imbihl and R. Schlögl, “Strained Thin Copper Films as Model Catalysts in the Materials Gap”, Catalysis Letters, 102, pp. 91-97 (2005).

10. T.K. Schmidt*, T.J. Balk, G. Dehm and E. Arzt, “Influence of Tantalum and Silver Interlayers on Thermal Stress Evolution in Copper Thin Films on Silicon Substrates”, Scripta Materialia, 50, pp. 733-737 (2004).

9. G. Dehm*, T.J. Balk, H. Edongué and E. Arzt, “Small-Scale Plasticity in Thin Cu and Al Films”, Microelectronic Engineering, 70, pp. 412-424 (2003).

8. T.J. Balk*, G. Dehm and E. Arzt, “Parallel Glide: Unexpected Dislocation Motion Parallel to the Substrate in Ultrathin Copper Films”, Acta Materialia, 51, pp. 4471-4485 (2003).

7. G. Dehm*, T.J. Balk, B. von Blanckenhagen, P. Gumbsch and E. Arzt, “Dislocation Dynamics in Sub-Micron Confinement: Recent Progress in Cu Thin Film Plasticity”, Zeitschrift für Metallkunde, 93, pp. 383-391 (2002).

6. G. Dehm*, B.J. Inkson, T. Wagner, T.J. Balk and E. Arzt, “Plasticity and Interfacial Dislocation Mechanisms in Epitaxial and Polycrystalline Al Films Constrained by Substrates”, Journal of Materials Science and Technology, 18, pp. 113-117 (2002).

5. J. Böhm, C.A. Volkert*, R. Mönig, T.J. Balk and E. Arzt, “Electromigration-Induced Damage in Bamboo Al Interconnects”, Journal of Electronic Materials, 31, pp. 45-49 (2002).

4. T.J. Balk and K.J. Hemker*, “High Resolution Transmission Electron Microscopy of Dislocation Core Dissociations in Gold and Iridium”, Philosophical Magazine A, 81, pp. 1507-1531 (2001).

3. T.J. Balk and K.J. Hemker*, “Experimental Observations of Dislocation Core Structures in Gold and Iridium”, Materials Science and Engineering A, A309-310, pp. 108-112 (2001).

2. T.J. Balk, M. Kumar and K.J. Hemker*, “Influence of Fe Substitutions on the Deformation Behavior and Fault Energies of Ni₃Ge-Fe₃Ge L1₂ Intermetallic Alloys”, Acta Materialia, 49, pp. 1725-1736 (2001).

1. T.J. Balk, M. Kumar and K.J. Hemker*, “Relating Alloy Chemistry, Dislocation Structure and Flow Strength in the (Ni_xFe_1-x)₃Ge System”, Scripta Materialia, 39, pp. 577-582 (1998).

BOOK AND ENCYCLOPEDIA CHAPTERS

1. M.J. Buehler, T.J. Balk, H. Gao and E. Arzt, “Constrained Grain Boundary Diffusion in Thin Copper Films”, invited chapter in the Handbook of Theoretical and Computational Nanotechnology, Editors W. Schommers and M. Rieth, American Scientific Publishers (ISBN:1-58883-042-X) Volume 5, Chapter 4, pp. 215-249 (2006).

EDITING OF CONFERENCE PROCEEDINGS VOLUMES

3. A. Misra, T.J. Balk, H. Huang, M.J. Caturla, C. Eberl (Editors), Nano- and Microscale Materials—Mechanical Properties and Behavior under Extreme Environments, Materials Research Society Symposium Proceedings, Volume 1137E, Warrendale, PA (2009).

2. T.J. Balk*, A. Minor, A. Porter and J. Plitzko (Editors), Electron Microscopy Across Hard and Soft Materials, Materials Research Society Symposium Proceedings, Volume 982E, Warrendale, PA (2007).

1. R.E. Rudd*, T.J. Balk, W. Windl and N. Bernstein (Editors), Linking Length Scales in the Mechanical Behavior of Materials, Materials Research Society Symposium Proceedings, Volume 882E, Warrendale, PA (2005).

PUBLICATIONS IN REFEREED CONFERENCE PROCEEDINGS

14. K.P. Kucera and T.J. Balk*, “Using Entry Level Engineering Courses as a Method of Promoting Industry Awareness”, American Society for Engineering Education, 2009 Annual Conference Proceedings, paper #AC 2009-633 (2009).

13. W.-C. Li, S.C. Schendel and T.J. Balk*, “Microstructure and Hydrogen Absorption/Desorption Behavior of Nanoporous Pd Thin Films”, in The Hydrogen Economy, Eds. Choudhury et al. (MRS Symp. Proc., 1098, Warrendale, PA), paper #1098.HH02.08 (2008).

12. Y. Sun and T.J. Balk*, “Mechanical Behavior and Microstructure of Nanoporous Gold Films”, in Mechanics of Nanoscale Materials and Devices, Eds. Misra et al. (MRS Symp. Proc., 924, Warrendale, PA), pp. Z1.2.1-6 (2006).

11. G. Wiederhirn, T.J. Balk, G. Dehm, J.A. Nucci, G. Richter and E. Arzt, “Passivation Effects in Copper Thin Films”, 8th International Workshop on Stress-Induced Phenomena in Metallization (American Institute of Physics Conference Proceedings, Volume 817), pp. 185-191 (2006).

10. M. Legros, G. Dehm and T.J. Balk, “In-Situ TEM Study of Plastic Stress Relaxation Mechanisms and Interface Effects in Metallic Films”, in Thin Films – Stresses and Mechanical Properties XI, Eds. Buchheit et al. (MRS Symp. Proc., 875, Warrendale, PA), pp. O9.1.1-11 (2005).

9. L. Sauter, T.J. Balk, G. Dehm, J.A. Nucci and E. Arzt, “Hillock Formation and Thermal Stresses in Thin Au Films on Si Substrates”, in Thin Films – Stresses and Mechanical Properties XI, Eds. Buchheit et al. (MRS Symp. Proc., 875, Warrendale, PA), pp. O5.2.1-6 (2005).

8. T.J. Balk*, G. Dehm and E. Arzt, “Parallel Glide: A Fundamentally Different Type of Dislocation Motion in Ultrathin Metal Films”, in Multiscale Phenomena in Materials – Experiments and Modeling Related to Mechanical Behavior, Eds. Hemker et al. (MRS Symp. Proc., 779, Warrendale, PA), pp. W4.4.1-10 (2003).

7. M. Legros, G. Dehm, T.J. Balk, E. Arzt, O. Bostrom, P. Gergaud, O. Thomas, and B. Kaouache, “Plasticity-Related Phenomena in Metallic Films on Substrates”, in Multiscale Phenomena in Materials – Experiments and Modeling Related to Mechanical Behavior, Eds. Hemker et al. (MRS Symp. Proc., 779, Warrendale, PA), pp. W4.2.1-12 (2003).

6. T.J. Balk*, G. Dehm and E. Arzt, “A New Type of Dislocation Mechanism in Ultrathin Copper Films”, in Thin Films – Stresses and Mechanical Properties IX, Eds. Ozkan et al. (MRS Symp. Proc., 695, Warrendale, PA), pp. L2.7.1-6 (2002).

5. T.J. Balk*, G. Dehm and E. Arzt, “Observations of Dislocation Motion and Stress Inhomogeneities in a Thin Copper Film”, in Dislocations and Deformation Mechanisms in Thin Films and Small Structures, Eds. Schwarz et al. (MRS Symp. Proc., 673, Warrendale, PA), pp. P2.7.1-6 (2001).

4. G. Dehm, B.J. Inkson, T.J. Balk, T. Wagner and E. Arzt, “Influence of Film/Substrate Interface Structure on Plasticity in Metal Thin Films”, in Dislocations and Deformation Mechanisms in Thin Films and Small Structures, Eds. Schwarz et al. (MRS Symp. Proc., 673, Warrendale, PA), pp. P2.6.1-12 (2001).

3. T.J. Balk*, M. Kumar, O.N. Mryasov, A.J. Freeman and K.J. Hemker, “Characterizing Deformation Mechanisms in Ni₃Ge-Fe₃Ge Intermetallic Alloys”, in High Temperature Ordered Intermetallic Alloys VIII, Eds. George et al. (MRS Symp. Proc., 552, Warrendale, PA), pp. KK10.8.1-7 (1999).

2. M. Kumar, T.J. Balk and K.J. Hemker, “Measurement of Planar Fault Energies in Ni₃Ge-Fe₃Ge Intermetallic Alloys”, in Multiscale Modeling of Materials, Eds. Bulatov et al. (MRS Symp. Proc., 538, Warrendale, PA), pp. 329-334 (1999).

1. T.J. Balk*, M. Kumar and K.J. Hemker, “Relating Mechanical Properties with Dislocation Cores in Ni₃Ge-Fe₃Ge Intermetallic Alloys”, in High Temperature Ordered Intermetallic Alloys VII, Eds. Koch et al. (MRS Symp. Proc., 460, Warrendale, PA), pp. 641-646 (1997).

ABSTRACTS AND NON-REFEREED CONFERENCE PROCEEDINGS

4. T.J. Balk, W.-C. Li and S. Roberts, “Effects of Annealing on Microstructure of Osmium-Ruthenium Thin Films”, Proceedings of the 2009 IEEE International Vacuum Electronics Conference (IVEC), paper P3.6, pp. 177-178 (2009).

3. T.J. Balk, W.-C. Li and S. Roberts, “Characterization of Osmium-Ruthenium Coatings for Porous Tungsten Dispenser Cathodes”, Proceedings of the 2008 IEEE International Vacuum Electronics Conference (IVEC), paper 3.3, pp. 42-43 (2008).

2. G. Dehm, H. Edongué, T.J. Balk and E. Arzt, “Mechanical Size-Effects and Dislocation Dynamics in Cu Thin Films”, Microscopy and Microanalysis, 9 (Supplement 3), pp. 246-247 (2003).

1. G. Dehm, T.J. Balk and E. Arzt, “Dislocation Mechanisms Controlling Plasticity in Thin Al and Cu Films Constrained by Substrates”, Proceedings of the 15^th International Congress on Electron Microscopy (ICEM), Durban, South Africa, Vol. 1, pp. 927-928 (2002).