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Professional Preparation

Ph.D., Applied Physics, California Institute of Technology
M.S., Applied Physics, California Institute of Technology
B.S., Physics/Mathematics, California Institute of Technology

Appointments

2008 – present Professor of Materials Engineering, Chemical and Materials Engineering Dept.

2008 – present Participating Faculty, NSF/UK IGERT Program on Engineered Bioactive Interfaces and Devices

2008 – present Faculty Member, UK Institute for Sustainable Manufacturing

2008 – present Faculty Member, UK Center for Advanced Materials

2008 – present Participating Faculty: The Power and Energy Education Institute at the University of Kentucky

2008 – present Participating Faculty, Kentucky-Argonne Battery Manufacturing R&D Center

2004 – Present Guest Professor, Institute of Mechanics, Institute of Mechanics, Chinese Academy of Sciences, Beijing, China

2002 – 2009 Adjunct Professor, Dept. of Mechanical, Automotive & Materials Engineering, University of Windsor

2003 – 2007 Visiting Professor, Brown University, Division of Engineering

Spring 2006 Professor of Industrial Engineering and Materials Engineering, Purdue University

2004 – 2008 Technical Fellow, General Motors Research and Development Center

2003 – 2006 Lab Group Manager, Engineered Surfaces and Functional Materials, General Motors Research and Development Center

1999 – 2003 Lab Group Manager, Engineered Surfaces and Tribology, General Motors Research and Development Center

2001- 2004 Senior Staff Research Scientist, General Motors Research and Development Center

1992 – 2001 Staff Research Scientist, General Motors Research and Development Center

1987 – 1992 Senior Research Scientist, General Motors Research and Development Center

Publications

1. Y.-T. Cheng and M. W. Verbrugge, “Application of Hasselman’s Crack Propagation Model to Insertion Electrodes,” Electrochemical and Solid-State Letters 13, A128 (2010).
2. Y.-T. Cheng and M. W. Verbrugge, “Diffusion-Induced Stress, Interfacial Charge Transfer, and Criteria for Avoiding Crack Initiation of Electrode Particles,” J. Electrochem. Soc. 157, A508 (2010).
3. Y.-T. Cheng and M. W. Verbrugge, “The influence of surface mechanics on diffusion induced stresses within spherical nanoparticles,” J. Appl. Phys. 104, 083521 (2008).
4. Y.-T. Cheng and D. S. Grummon, “Indentation in shape memory alloys,” in Micro and Nano Mechanical Testing of Materials and Devices, edited by F.Q. Yang and J.C.M. Li (Springer, New York, 2008), pp. 71-86.
5. Y. Zhang, Y.T. Cheng, and D. S. Grummon “Shape memory surfaces,” Appl. Phys. Lett. 89, 041912 (2006).
6. X. Xiao, T. Xie, and Y.-T. Cheng, “Self-healable graphene polymer composites,” Journal of Materials Chemistry 20, 3508 (2010).
7. Y.-T. Cheng and F.Q. Yang, “Obtaining shear relaxation modulus and creep compliance of linear viscoelastic materials from instrumented indentation using axisymmetric indenters of power-law profiles,” J. Materials Research 24, 3013 (2009).
8. Y.-T. Cheng and D. E. Rodak, “Is the lotus leaf superhydrophobic?” Appl. Phys. Lett. 86, 144101 (2005).
9. Y.-T. Cheng and C.-M. Cheng, “Scaling, dimensional analysis, and indentation measurements,” Materials Science and Engineering Reports: A Review Journal R44, 91 (2004).
10. Y.-T. Cheng, “Thermodynamic and Fractal Geometric Aspects of Ion-Solid Interactions,” Materials Science and Engineering R: Reports (formerly Mat. Sci. Rep.) 5, 45 (1990).