FEI Helios Nanolab 660 Features

Imaging

Field Emission Gun (Schottky emitter), with UC technology (monochromator)
Sub-nanometer resolution from 500 V to 30 kV

Beam deceleration capabilities (stage bias)
Specimen Stage: x, y 150 mm; z 10mm all piezo driven; tilt -10 to +60°

Six electron detectors for optimal imaging

Focused Ion Beam (FIB)

Gallium LMIS (Liquid Metal Ion Source) for precision milling, cross-sectioning, TEM sample preparation

Gas Injection System (GIS) for metal and insulator deposition

Slice milling and imaging steps automated for 3D SEM reconstruction

Characterization

Oxford EDX detector for elemental analysis
Oxford EBSD detector for crystal orientation analysis

3D EDX and EBSD capabilties

 

Ideal for: Ultra high resolution imaging, in-situ cross-sectioning and TEM sample preparation, automated surface pattern generation (milling or deposition), 3D SEM, EDS and EBSD reconstruction