Capabilities
The process of engineering and fabricating structures 1-100 nanometers in size, which defines "nanoscale,"is not straightforward. Understanding the science of nanoscale world is very important; yet, using these fundamental principles to engineer "bottom-up" processes in nanoscale world is equally challenging. Cutting-edge research facilities to carry out "top-down" and "bottom-up" nanofabrication include the following capabilities currently operational:
- Thin Film Deposition:
- A thickness-controlled e-beam evaporator, thermal evaporation systems, a Five-target sputter evaporation system, electrochemical deposition, plasma-enhanced chemical vapor deposition, and atomic layer deposition system.
- Thermal and Chemical Processing:
- Oxidation, diffusion and annealing furnaces including a 4-furnace bank of 3-zone oxidation and dopant diffusion furnaces, chemical treatment facility (cleaning, etching functionalization), plasma oxidation, plasmatic reaction etching, and ion-beam etching.
- Device Fabrication:
- Photolithography. This room will allow experimenters to have a carefully controlled space with less than 100 particles of one micron size or larger per cubic foot of air, to accomplish their nanotechnology related research. The temperature and humidity of the room will be tightly controlled and there will be workspace available for individualized projects. Other capibilities include wafer coating and spin-coating station, alignment station, profilometer, and e-beam lithography with 20mm resolution.
- Metrology:
- Four-point resistance, spectroscopic / elliposometer, optical microscopes, scanning electron microscope, and parameter analyzers.
Equipment and Instrument Information